Hakkımızda Ürünler Haberler Teknik Destek İletişim

Express-BD7
COM Express Basic Size Type 7 Module with Up to 16 cores Intel® Xeon D and Pentium® D SoC (formerly codename: Broadwell-DE)
  • Up to 16 cores Intel® Xeon D Series SoC (formerly codename: Broadwell-DE)
  • 32 GB Dual Channel DDR4 at 2133/2400 MHz
  • 2 x 10GbE+ GbE and NC-SI
  • Up to 32 PCIe lanes
  • GbE, 2xSATA 6 Gb/s, 4x USB 3.0/2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (build option)
  • Express-BD7-D1559 Intel Broadwell-DE D1559, 12C (eTEMP)
    Express-BD7-D1539 Intel Broadwell-DE D1539, 8C (eTEMP)
    Express-BD7-D1519 Intel Broadwell-DE D1519, 4C (eTEMP)
    Express-BD7-D1577 Intel Broadwell-DE D1577, 16C
    Express-BD7-D1548 Intel Broadwell-DE D1548, 8C
    Express-BD7-D1527 Intel Broadwell-DE D1527, 4C
    Express-BD7-D1508 Intel Broadwell-DE D1508, 2C
Express-SL/SLE
COM Express Basic Size Type 6 Module with 6th Gen Intel Core, Xeon and Celeron Processors (codename: Skylake)
  • Intel QM170/HM170/CM236 Chipset
  • 32GB dual channel DDR4 at 1866/2133 MHz
  • 3x DDI channels, 1x LVDS (or eDP), 3 independent displays
  • 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (opt.)
Express-BL
COM Express Basic Size Type 6 Module with 5th Gen Intel Core and Xeon Processors (codename: Broadwell)
  • 5th Gen Intel Core and Xeon Processors (codename: Broadwell)
  • Up to 32GB dual channel DDR3L at 1600 MHz
  • 3x DDI channels, one LVDS and VGA, support up to 3 independent displays
  • Seven PCIe x1 and one PCIe x16
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature:-40°C to +85°C (build option)
Express-BE
COM Express® Basic Size Type 6 Module with AMD® Embedded R-Series APU
  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Up to 16GB Dual Channel DDR3L at 1600/1333 MHz
  • Three DDI ports and one LVDS port supporting 4 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
cExpress-BL 
Compact COM Express® Type 6 Module with 5th Generation Intel® Core™ i7/i5/i3 System-on-Chip
  • 5th Generation Low Power Intel® Core™ i7/i5/i3 Processor System-on-Chip
  • Up to 16 GB DDR3L SDRAM at 1600MHz
  • Two DDI channels, one LVDS supporting 3 independent displays
  • Dual channel 18/24-bit LVDS (or optional eDP
  • Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
  • Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)
Express-HLE
COM Express Basic Size Type 6 Module with 4th Generation Intel Core i7/i5/i3 Processor with ECC memory
  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Dual channel with ECC 1600/1333 MHz DDR3L memory up to 16GB in dual SODIMM socket
  • Three DDI ports support 3 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
cExpress-HL  
COM Express® Compact Size Type 6 Module with 4th Generation Intel® Core™ i7/i5/i3 Processor System-on-Chip
  • 4th Generation Intel® Core™ i7/i5/i3 Processor SoC
  • Up to 16 GB DDR3L SDRAM at 1600MHz
  • Two DDI channels, one LVDS supporting 3 independent displays
  • Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
  • Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
Express-IBR
Extreme Rugged™ COM Express® Type 6 Computer-on-Module with 3rd Generation Intel® Core™ Processor and QM77 Chipset
  • Up to 16GB ECC 1600MHz DDR3 memory in two SODIMM sockets
  • Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
  • Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for graphics (or general purpose x8/4/1)
  • Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, eight USB 2.0, 4 USB 3.0
  • COM Express® COM.0 R2.0 Type 6 Pinout
  • Extended Temperature: -40°C to +85°C
  • 50% Thicker PCB for high vibration environments
Express-HL
COM Express Extreme Rugged Type 6 Module with 4th Generation Intel® Core™ i7/i5/i3 Processor
  • Fourth Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Up to 32GB Dual Channel DDR3L SDRAM at 1600MHz
  • Three DDI channels supporting 3 independent displays
  • Six PCIe x1, one PCIe x16
  • Four SATA 6 Gb/s, Gigabit Ethernet, four USB 3.0, four USB 2.0
Express-CVC
Compact COM Express® Module with Dual Core Intel® Atom™ Processor and Intel® NM10 Express Chipset
  • N2600/ N2800/ D2550 Dual Core Atom™ processor up to 1.86GHz
  • Intel® NM10 Express Chipset
  • Up to 4 GB DDR3 SDRAM at 800/1066 MHz
  • Three free PCIe x1 lanes
  • VGA and LVDS support, DisplayPort connector on module
  • SATA 3 Gb/s, IDE (PATA), GbE, USB 2.0