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Express-BD7 |
COM Express Basic Size Type 7 Module with Up to 16 cores Intel® Xeon D and Pentium® D SoC (formerly codename: Broadwell-DE) |
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- Up to 16 cores Intel® Xeon D Series SoC (formerly codename: Broadwell-DE)
- 32 GB Dual Channel DDR4 at 2133/2400 MHz
- 2 x 10GbE+ GbE and NC-SI
- Up to 32 PCIe lanes
- GbE, 2xSATA 6 Gb/s, 4x USB 3.0/2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged operating temperature: -40°C to +85°C (build option)
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Express-BD7-D1559 |
Intel Broadwell-DE D1559, 12C (eTEMP) |
Express-BD7-D1539 |
Intel Broadwell-DE D1539, 8C (eTEMP) |
Express-BD7-D1519 |
Intel Broadwell-DE D1519, 4C (eTEMP) |
Express-BD7-D1577 |
Intel Broadwell-DE D1577, 16C |
Express-BD7-D1548 |
Intel Broadwell-DE D1548, 8C |
Express-BD7-D1527 |
Intel Broadwell-DE D1527, 4C |
Express-BD7-D1508 |
Intel Broadwell-DE D1508, 2C |
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Express-SL/SLE |
COM Express Basic Size Type 6 Module with 6th Gen Intel Core, Xeon and Celeron Processors (codename: Skylake) |
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- Intel QM170/HM170/CM236 Chipset
- 32GB dual channel DDR4 at 1866/2133 MHz
- 3x DDI channels, 1x LVDS (or eDP), 3 independent displays
- 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
- GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged operating temperature: -40°C to +85°C (opt.)
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Express-BL |
COM Express Basic Size Type 6 Module with 5th Gen Intel Core and Xeon Processors (codename: Broadwell) |
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- 5th Gen Intel Core and Xeon Processors (codename: Broadwell)
- Up to 32GB dual channel DDR3L at 1600 MHz
- 3x DDI channels, one LVDS and VGA, support up to 3 independent displays
- Seven PCIe x1 and one PCIe x16
- GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged operating temperature:-40°C to +85°C (build option)
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Express-BE |
COM Express® Basic Size Type 6 Module with AMD® Embedded R-Series APU |
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- AMD® Embedded R-Series APU with A77E Fusion Controller Hub
- Up to 16GB Dual Channel DDR3L at 1600/1333 MHz
- Three DDI ports and one LVDS port supporting 4 independent displays
- Seven PCIe x1, one PCIe x16
- GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
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cExpress-BL |
Compact COM Express® Type 6 Module with 5th Generation Intel® Core™ i7/i5/i3 System-on-Chip |
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- 5th Generation Low Power Intel® Core™ i7/i5/i3 Processor System-on-Chip
- Up to 16 GB DDR3L SDRAM at 1600MHz
- Two DDI channels, one LVDS supporting 3 independent displays
- Dual channel 18/24-bit LVDS (or optional eDP
- Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
- Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged™ operating temperature: -40°C to +85°C (optional)
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Express-HLE |
COM Express Basic Size Type 6 Module with 4th Generation Intel Core i7/i5/i3 Processor with ECC memory |
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- 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
- Dual channel with ECC 1600/1333 MHz DDR3L memory up to 16GB in dual SODIMM socket
- Three DDI ports support 3 independent displays
- Seven PCIe x1, one PCIe x16
- GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
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cExpress-HL |
COM Express® Compact Size Type 6 Module with 4th Generation Intel® Core™ i7/i5/i3 Processor System-on-Chip |
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- 4th Generation Intel® Core™ i7/i5/i3 Processor SoC
- Up to 16 GB DDR3L SDRAM at 1600MHz
- Two DDI channels, one LVDS supporting 3 independent displays
- Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
- Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
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Express-IBR
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Extreme Rugged™ COM Express® Type 6 Computer-on-Module with 3rd Generation Intel® Core™ Processor and QM77 Chipset |
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- Up to 16GB ECC 1600MHz DDR3 memory in two SODIMM sockets
- Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
- Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for graphics (or general purpose x8/4/1)
- Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, eight USB 2.0, 4 USB 3.0
- COM Express® COM.0 R2.0 Type 6 Pinout
- Extended Temperature: -40°C to +85°C
- 50% Thicker PCB for high vibration environments
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Express-HL
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COM Express Extreme Rugged Type 6 Module with 4th Generation Intel® Core™ i7/i5/i3 Processor |
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- Fourth Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
- Up to 32GB Dual Channel DDR3L SDRAM at 1600MHz
- Three DDI channels supporting 3 independent displays
- Six PCIe x1, one PCIe x16
- Four SATA 6 Gb/s, Gigabit Ethernet, four USB 3.0, four USB 2.0
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Express-CVC
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Compact COM Express® Module with Dual Core Intel® Atom™ Processor and Intel® NM10 Express Chipset |
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- N2600/ N2800/ D2550 Dual Core Atom™ processor up to 1.86GHz
- Intel® NM10 Express Chipset
- Up to 4 GB DDR3 SDRAM at 800/1066 MHz
- Three free PCIe x1 lanes
- VGA and LVDS support, DisplayPort connector on module
- SATA 3 Gb/s, IDE (PATA), GbE, USB 2.0
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